Electronics, semiconductor & solar
High performance lenses for use with 1.1” image sensors
17/01/2019
The new Fujinon CF-ZA-1S series of ultrahigh resolution lenses has been introduced for high precision inspection and measurement applications using cameras featuring 1.1” image sensors. Satisfying the growing popularity for these larger diameter sensors with a small 2.5 µm pixel pitch (equivalent to 23 Mpixels), the new range contains lenses with focal lengths from 8 to 50 mm.
High speed, high resolution inline smart 3D inspection
11/01/2019
The introduction of new Gocator® laser line profilers, snapshot sensors and the GoMax plug and play smart vision accelerator by LMI Technologies transforms inline quality inspection capabilities. The 2500 series of smart sensors are the fastest, most compact, and advanced Gocator® 3D laser line profilers to date. The Gocator 3504 is the highest XY resolution 3D snapshot sensor on the market today. GoMax® can accelerate any Gocator® by adding massive GPU-driven data processing power to the sensor (or sensor network).
5 Gb GigE Vision cameras give higher data rates over long cable lengths
07/12/2018
The new Genie Nano-5G GigE Vision cameras from Teledyne DALSA provide exceptional data transfer capabilities using industry-standard Ethernet technology at an extremely attractive price point. With data transfer rates in excess of 5 Gb/s possible over cable lengths up to 100 metres, and a choice of high performance Sony sensors, these new cameras open up a host of new applications in a wide range of industries.
Automotive PCB assembly enhanced
24/01/2019
A new approach to manual PCB assembly verification has helped one manufacturer significantly improve the quality of boards it manufactures for use in car audio devices. A self-contained camera system ensures that almost 50 components are correctly assembled before the boards move to the next stage.
Inline testing of the wettability of material surfaces
21/06/2018
With the new bonNDTinspect® system, Automation W+R enables the reliable assessment of surfaces that are to be bonded, painted or otherwise treated in subsequent process steps. The system is based on a patent held by Fraunhofer IFAM and machine vision components from STEMMER IMAGING.