Electronics, semiconductor & solar
High resolution trilinear colour camera reduces integration costs
10/09/2019
Teledyne DALSA’s new Piranha4 8k trilinear colour camera offers improved colour imaging at a lower cost using Teledyne e2v’s latest CMOS 8k trilinear sensor. Independent exposure control for each channel for uniform image brightness and an ASCII command or an advanced GenICam-compliant interface makes the camera easier to setup, control, and integrate into high resolution application sub-systems or OEM solutions. Application areas include printing, PCB, electronics, film, and large format web inspection.
Ricoh high-performance 5 Megapixel lens range extended
14/03/2019
Ricoh has added the new FL-CC-MX series to its existing range of lenses for 2/3” 5 megapixel cameras. These high-performance lenses with 12 and 16mm focal length versions provide high resolution, high contrast imaging with low distortion across the entire sensor, ensuring accurate measurements at the periphery of the image as well as at the centre.
Smart IR thermal imaging cameras ready for Industry 4.0
27/02/2019
The new range of IRSX industrial IR cameras from Automation Technology are designed to facilitate the use of thermal imaging in Industry 4.0 applications. Completely self-contained with embedded data processing, these compact, rugged cameras feature a multitude of interface protocols for direct communication with automation and control equipment. These include OPC-UA, a platform-independent, open standard for machine-to-machine communication which is ideally suited for Industry 4.0.
Direct interfacing of smart 3D vision system with robots
28/08/2019
The use of small to medium-sized collaborative robots for factory automation applications is growing at a rapid rate. Many of these applications are pick-and-place, so the robots require machine vision to visualize the scene, process information to make control decisions and execute precision-based mechanical movements.
Automotive PCB assembly enhanced
24/01/2019
A new approach to manual PCB assembly verification has helped one manufacturer significantly improve the quality of boards it manufactures for use in car audio devices. A self-contained camera system ensures that almost 50 components are correctly assembled before the boards move to the next stage.
Inline testing of the wettability of material surfaces
21/06/2018
With the new bonNDTinspect® system, Automation W+R enables the reliable assessment of surfaces that are to be bonded, painted or otherwise treated in subsequent process steps. The system is based on a patent held by Fraunhofer IFAM and machine vision components from STEMMER IMAGING.