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GenICam compatibility for Intel® 400 Series of RealSense™ imaging technology

17 Dec 2018

STEMMER IMAGING has developed a GenICam Transport Layer (GenTL) for the innovative Intel® 400 Series of RealSense™ stereo cameras and depth modules to make them GenICam compliant. This greatly enhances the use of Intel® RealSense™ imaging technology in machine vision systems by providing connectivity to all GenTL-compliant software packages for further processing and analysis.

The GenICam standard is the base for plug & play handling of cameras and devices in machine vision systems. The RealSense™ Transport Layer maps the features and commands from the RealSense™ SDK to a GenICam format. This creates a nodemap for the camera that allows for discovery, connection, and control of the device and, of course, image acquisition. This makes RealSense™ cameras 'self describing' in the same way as GigE Vision and USB3Vision cameras.

The RealSense™ revolution

Intel® RealSense™ technology is changing the future of 3D imaging by providing high speed stereoscopic vision in an embedded package with a large depth of field. The RealSense™ D400 Series of stereo cameras feature depth sensors and an RGB sensor. Each pixel from the depth sensors contributes to a depth map, which conveys the distance information between points on an object’s surface and the camera. RealSense™ represents a major development for 3D depth imaging and sets new levels of performance at a price point that opens up the use of 3D imaging to high volume embedded applications.

The range includes both cameras and board level modules with depth computation via a next generation Intel ASIC. Two USB-powered depth cameras with housings, the D415 and D435, are available, with dual depth sensors for up to 90 fps depth stream and up to 1280 x 720 resolution active stereo depth. The D435 differs from the D415 in that it has global shutter rather than rolling shutter IR cameras for better capture of fast moving scenes. It also has an additional 20 degree field of view to capture a wider view of the environment.

The Intel® RealSense™ Depth Module D400 Series provides a turnkey solution for rapid product development and integration for VR, Robotics, and any market where depth matters. This modular approach provides the flexibility to address the needs of many different market segments. In particular it brings 3D perception capabilities to the growing embedded vision sector, with modules optimised for embedded power and performance.

The core of the system, the unique Intel® RealSense™ Vision Processor D4, uses advanced algorithms to process raw image streams from the depth cameras and computes high resolution 3D depth maps without the need for a dedicated GPU or host processor. By freeing up bandwidth from the host processor, it leaves more CPU time for vision processing or alternatively reduces the performance requirements of the host system.

Screenshot of CVB’s GenICam Browser, showing the discovery of a RealSense D415 camera

A CVB example showing a RealSense rangemap (grey level, height-encoded 2D image) being converted to a pointcloud (3D co-ordinates)

The benefits of GenICam compliance

Adding the transport layer to bring GenICam compliance makes it much easier to integrate the extensive capabilities offered by RealSense™ technology into industrial vision systems and take advantage of other machine vision software. The new GenTL is currently available for Intel PC platforms, with ARM platforms following shortly.

It is available at no extra cost within CVB 2018 Image Manager, for use with STEMMER IMAGING’s Common Vision Blox hardware-independent machine vision development software, or Teledyne DALSA’s Sherlock. The GenTL can also be purchased for use with other analysis tools capable of grabbing images via Genicam/GenTL such as MVTec Halcon.

CVB 2018 Image Manager is the core component of Common Vision Blox (CVB) and offers exceptional functionality in image acquisition, image handling, image display and image processing. It features powerful core 3D capability to handle point clouds and pre-existing calibrations as well as the display of 3D data. A new tool called CVB Match 3D allows a point cloud to be compared to a template point cloud, returning the 3D transformation between the two. It can be useful for 3D positioning systems and also for calculating the differences for quality control applications.

RealSense™ integration support

In addition to being able to provide RealSense components, as well as CVB and other software such as Teledyne DALSA Sherlock, STEMMER IMAGING brings in-depth knowledge of using the RealSense™ SDK. This includes expertise in extracting depth data from the camera and using the interpretation of this data in embedded applications on Intel and ARM platforms. Extensive experience in 3D applications support in general also helps with the acceleration of RealSense™ integration.

Author

Dr. Jonathan Vickers,
Common Vision Blox Product Manager
STEMMER IMAGING

Intel

Santa Clara, United States

Founded in 1968 as a manufacturer for semiconductors and integrated electronics, Intel is now one of the biggest manufacturers for microelectronics.

Intel RealSense D400
  • High speed 3D imaging and processing in an embedded package
  • Versatile and robust, for indoor and outdoor applications
  • Ready to use with USB 3.0 interface and Intel® RealSense™ SDK