STEMMER IMAGING

STEMMER IMAGING to promote Intel® D400 series of RealSense™ imaging technology

29 Sep 2017

STEMMER IMAGING have been appointed as an approved supplier for Intel® RealSense™ technology and will promote and provide support services to accelerate the integration of the latest D400 series of Intel RealSense™ 3D imaging technology into real world applications.

The RealSense™ camera D400 series from Intel® is a modular concept that provides depth information and full colour HD images for both indoors and outdoors applications. It utilises proven Intel® depth sensor technology and includes a range of cameras and board level modules with depth computation on a next generation Intel® ASIC. The technology supports both PC and embedded applications.

 

This exciting new technology represents a major development for 3D depth imaging. It sets new levels of performance at a price point that opens up the use of 3D imaging to high volume embedded applications.

Mark Williamson, Director – Corporate Market Development at STEMMER IMAGING

Mark Williamson, Director – Corporate Market Development at STEMMER IMAGING, said:

“This exciting new technology represents a major development for 3D depth imaging. It sets new levels of performance at a price point that opens up the use of 3D imaging to high volume embedded applications. It will have many applications in a wide variety of industries including retail, robotics and drones. The modular approach provides the flexibility to address the needs of many different market segments. In particular it brings 3D perception capabilities to the growing embedded vision sector, with modules optimised for embedded power and performance.”

Intel® engineers will introduce this highly innovative technology with talks and live demos at the STEMMER IMAGING Machine Vision Technology Forum Tour 2017.

• Suppliers
• Products

Intel

Santa Clara, United States

Founded in 1968 as a manufacturer for semiconductors and integrated electronics, Intel is now one of the biggest manufacturers for microelectronics.

Intel® RealSense™ D400 series

• High speed 3D imaging and processing in an embedded package
• Versatile and robust, for indoor and outdoor applications
• Ready to use with USB 3.0 interface and Intel® RealSense™ SDK