Machine vision - Electronics, semiconductor & solar

ELECTRONICS INDUSTRY

Error detection in high speed and high precision

Electronics, semiconductor & solar

Production speed and quality are essential in wafer manufacturing or printed circuit board inspection. Here manufacturers place trust in the fastest and highest resolution cameras, delivered by STEMMER IMAGING.

High performance lenses for use with 1.1” image sensors

17/01/2019

The new Fujinon CF-ZA-1S series of ultrahigh resolution lenses has been introduced for high precision inspection and measurement applications using cameras featuring 1.1” image sensors. Satisfying the growing popularity for these larger diameter sensors with a small 2.5 µm pixel pitch (equivalent to 23 Mpixels), the new range contains lenses with focal lengths from 8 to 50 mm.

High speed, high resolution inline smart 3D inspection

11/01/2019

The introduction of new Gocator® laser line profilers, snapshot sensors and the GoMax plug and play smart vision accelerator by LMI Technologies transforms inline quality inspection capabilities. The 2500 series of smart sensors are the fastest, most compact, and advanced Gocator® 3D laser line profilers to date. The Gocator 3504 is the highest XY resolution 3D snapshot sensor on the market today. GoMax® can accelerate any Gocator® by adding massive GPU-driven data processing power to the sensor (or sensor network).

5 Gb GigE Vision cameras give higher data rates over long cable lengths

07/12/2018

The new Genie Nano-5G GigE Vision cameras from Teledyne DALSA provide exceptional data transfer capabilities using industry-standard Ethernet technology at an extremely attractive price point. With data transfer rates in excess of 5 Gb/s possible over cable lengths up to 100 metres, and a choice of high performance Sony sensors, these new cameras open up a host of new applications in a wide range of industries.

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Inline testing of the wettability of material surfaces

21/06/2018

With the new bonNDTinspect® system, Automation W+R enables the reliable assessment of surfaces that are to be bonded, painted or otherwise treated in subsequent process steps. The system is based on a patent held by Fraunhofer IFAM and machine vision components from STEMMER IMAGING.

All applications about Electronics, Semiconductor & Solar

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