Vieworks VCS-14MX2 Camera

• 14 MP resolution (4,608 × 3,072) on a back-side illuminated CMOS sensor with 5.5 µm pixels: holding onto light sensitivity that front-illuminated sensors give up at this resolution.
• Up to 338 fps at full resolution: over four-lane CoaXPress 2.0 (50 Gbps), or up to 21,037 fps in a 32-line partial scan window.
• Global shutter with on-camera correction: DSNU, PRNU, flat-field and defective pixel correction, plus an HDR mode combining low- and high-gain exposures for high-contrast surfaces.
• Two housing options, one specification: fan-cooled (83.3 mm) or heat-sink (86.6 mm), both rated for 0 to 40°C operation with identical electrical and optical specifications.
• M42 lens mount as standard: with custom mounts available on request

As sensor resolution increases at a fixed pixel size, one of two things usually gives. Either the data volume outpaces the interface and frame rate drops, or the wiring needed to read out more pixels shadows part of each pixel and sensitivity falls.

On Print, Printed Circuit Board (PCB) and semiconductor inspection lines running at production speed, this typically forces a choice: slow the line to preserve image quality or accept reduced defect sensitivity to keep pace. For lower-throughput inspection tasks, a simpler CMOS camera at lower resolution remains the more cost-effective choice.

The VCS-14MX2 is built to remove that trade-off rather than manage it. 

The combination of Gpixel's GSPRINT5514 BSI sensor and a four-lane CoaXPress 2.0 interface lets the VCS-14MX2 read out the full 14 MP frame at up to 338 fps, with a maximum data rate of 50 Gbps. Global shutter capture avoids the distortion that rolling shutter introduces on fast-moving parts or webs. On-camera correction for Dark Signal Non-Uniformity (DSNU) and Photo-Response Non-Uniformity (PRNU), combined with real-time flat-field correction (FFC), keeps output consistent across the full sensor area rather than only at its centre.

• Full 14 MP images at up to 338 fps
• Light sensitivity retained at high resolution, not traded away for it
• Up to 21,037 fps available in a 32-line partial scan window
• Consistent correction and output across both mono and colour variants

14 MP Back-Side Illuminated Sensor

The GSPRINT5514 sensor pairs 4,608 × 3,072 resolution with 5.5 µm pixels and BSI technology, giving inspection engineers fine feature detail without the sensitivity penalty a front-illuminated sensor would carry at the same resolution.

Four-Lane CoaXPress 2.0 Interface

CXP-12 across four coaxial connections delivers up to 50 Gbps of throughput, so the camera's interface keeps pace with full-resolution capture at 338 fps rather than becoming the bottleneck on a fast line.

On-Camera Image Correction

DSNU, PRNU, flat-field and defective pixel correction run on the camera itself, so uniformity is maintained across the whole sensor, and less correction work is pushed onto the host PC or FPGA.

HDR Composite Mode

A low-gain and high-gain exposure pair combine into a single composite image, extending dynamic range for scenes that mix bright reflections and dark features - common on soldered PCBs and metallic or glass substrates.

Partial Scan for Ultra-High-Speed Windows

Reducing the active area to 32 lines pushes frame rate up to 21,037 fps, useful where only a narrow region of interest needs to be captured at very high speed, such as web inspection or fast trigger sequences.

GenICam and CVB Compatibility

As a GenICam-compliant CoaXPress camera, the VCS-14MX2 integrates with STEMMER IMAGING's CVB Common Vision Blox through a standard GenICam GenTL interface, giving developers direct, standardised access to camera parameters.

Large-substrate display inspection benefits from the VCS-14MX2's combination of high resolution and full-frame speed, catching pixel-level defects without slowing the line. The colour variant supports chromatic defect detection where mono resolution alone isn't enough to characterise a fault.

Fine-pitch component placement and solder joint inspection both depend on resolving small features reliably across the full field of view. The HDR composite mode helps here specifically, holding detail in both reflective solder and darker board substrate within a single capture.

Wafer and die-level feature inspection needs both the resolution to resolve fine structures and the throughput to keep pace with handling equipment. Global shutter capture keeps geometry accurate even where parts are indexed or in motion during acquisition.

Outside high-speed production lines, the same sensor and resolution suit lower-throughput applications where image uniformity and fine detail matter more than raw frame rate.

STEMMER IMAGING supports the VCS-14MX2 from initial feasibility through to production deployment, backed by a manufacturer-independent portfolio and the Technical Competence Centre.

Choose it when an inspection task needs both high resolution and high throughput at once - for example, catching fine defects on a fast-moving FPD or PCB line. If the application only needs one or the other, a lower-resolution or lower-speed camera will usually be the more cost-effective option.

Both share identical sensor, interface and image performance specifications. They differ only in physical length (83.3 mm vs 86.6 mm), weight (460 g vs 470 g) and cooling method, so the choice depends on the requirements of airflow, vibration tolerance and ambient conditions. 

Yes. The camera is GenICam-compliant, which allows it to integrate with CVB through the standard GenICam GenTL interface for camera control and image acquisition.

Both share identical sensor, interface and image performance specifications. They differ only in physical length (83.3 mm vs 86.6 mm), weight (460 g vs 470 g) and cooling method, so the choice depends on the requirements of airflow, vibration tolerance and ambient conditions. 

Partial scan reduces the active sensor area to as few as 32 lines, increasing the maximum frame rate to 21,037 fps. It suits applications that only need to capture a narrow region of interest at very high speed, such as fast trigger-based inspection windows.

Yes, mono and colour (RG Bayer) versions are both available at 8, 10 or 12-bit pixel depth, so the same camera platform covers greyscale defect detection and chromatic inspection tasks.

M42 is the standard mount, with custom mounts available on request for specific optical or mechanical requirements.

Yes, this is exactly what Engineering Services' feasibility testing is for - verifying resolution, speed and dynamic range against the actual application before the camera is specified into a system.