From Portfolio to Proof.

Why attend 

This event is your unique opportunity to get direct answers to specific technical questions from the Teledyne Vision Solutions product managers and technical experts from Canada. 

New technology you haven't seen yet - including the Tetra line scan platform, and new hyperspectral technology.

Best-in-class at a unbeatable price point - high speed, high image quality - changing the cost equation for line scan applications. 

From SWIR to hyperspectral at unprecedented speed - spectral imaging across the full range

Engineering value, not product pitches - every session addresses a real engineering decision

Event at a glance 

Day 1 - 15 April - Meet the Experts – On-site

10:00 – 16:30 One-to-one meetings with Teledyne Vision Solutions product managers. Limited slots, booking via registration form.
17:00 PM    Round-off the day: Get-Together with Food, Drinks and informal networking.

Day 2 - 16 April - Technology Day – On-site & Online 

Sessions cover: semiconductor inspection at speed, interface-agnostic system design, multi-camera sorting systems, contact image sensors for web scanning and metrology, microscopic surface inspection, and 3D optical metrology.

10:00 – 12.00 Technology and product focussed Sessions - Attend Online

13:00 – 16.30 Deep-Dives and workstation time with Teledyne experts, Live Q&A: technical discussion and troubleshooting across use cases and setups

Day 1 - Meet the Experts

The Teledyne Vision Solutions team in Munich

On Day 1, book your private one-to-one meeting with the specialist whose product area most closely matches your current project or evaluation. Select your preferred expert when registering.

Dale Deering
VP Product Marketing & LineScan Product Management

Over 25 years in machine vision spanning development and business leadership. Dale oversees product and business development for machine vision cameras at Teledyne, with deep expertise in high-speed and line-scan imaging applications. He serves on the A3 Vision & Imaging Technology Strategy Board. 

1D | TDI | Hyperspectral Imaging

Matthias Sonder
Technical Director & Product Manager

Technical Matthias leads technical strategy at Teledyne Vision Solutions and manages the Z3 product line. He is the right contact for in-depth technical architecture discussions and platform-level questions.

3D Metrology | Hyperspectral 

Riana Sartori
Director of Product Management

Riana is responsible for Teledyne's full area scan camera portfolio, covering USB3, GigE, CoaXPress, Camera Link, and CameraLink HS. She is the primary contact for 2D area scan product decisions, roadmap questions, and technical positioning across interfaces. 

2D | CMOS Sensors | Interfaces

Matt Moser
Product Manager

Matt brings 20 years of experience in CMOS sensor and camera R&D. His primary focus is 1D sensors and cameras, and he leads product management for the AxCIS line — the right contact for contact image sensor applications and high-resolution 1D imaging discussions.

Reserve your one-to-one session (15 April) 

Use the booking form to reserve your Meet the Experts slot. To make the most of your session, we recommend sharing your application context (requirements, constraints, and current setup) during registration. 

Day 2 – Sessions & Deep-dives

10.00 – 12.00 Presentations – Online & On-site 

Martin Grzymek, Senior Director Sales EMEA

The Teledyne Universe in Action

An application-led introduction to Teledyne's technology landscape. This session sets the context for the day — connecting sensing, acquisition and analysis technologies across inspection, metrology and industrial imaging.

Understand where Teledyne technologies are relevant before selecting your tracks.

Dale Deering
VP Product Marketing & LineScan Product Management 

Semiconductor Inspection at Speed

The semiconductor market is growing fast - and so is the need for inspection. Learn about the products and technologies that have made Teledyne the global leader for these inspections, from wafer and die-stacking to packaging and populated circuits, using UV or SWIR illumination to detect the invisible, enabling the speed and efficiency required for this highly competitive market.

Matt Moser
Product Manager – AxCIS 

Rapid Web Scanning & Metrology Deployment

Contact Image Sensors have made the deployment of web scanning systems significantly easier and more efficient. Learn how these all-in-one products can be rapidly deployed to reduce cost of ownership while delivering both image and accurate metrology data - with best-in-class image quality, factory-calibrated and ready to deploy. Multi-source illumination, high-dynamic range imaging, and flexible lighting configurations make it possible to isolate many different defect types without complex multi-component systems.

Manny Romero
Senior Product Manager – Frame Grabbers, Acquisition & 2D Cameras

Becoming Interface Agnostic - Minimising Development Across Diverse MV Interfaces

Companies building next-gen machine vision solutions need to move fast and efficiently. GenTL streamlines integration across MV interfaces, cutting development effort, vendor dependency and time to market. Next-gen GigE interfaces aggregate data and enable efficient embedded solutions. This session examines Ethernet-based RDMA approaches such as RoCEv2, covering performance, hardware support, scalability, and integration risks with a clear focus on practical realities and risks of interface adoption and management.

Matthias Sonder
Technical Director & Product Manager

High-Speed Microscopic Surface Inspection - Techniques for Efficient Nano-Scale Inspection

Microscopic surface inspection is particularly challenging when covering large areas with very fine details. Time-Delayed Integration and Linear Confocal Imaging address the constraints of limited illumination, nano-scale features, and rapid cycle times. The session also covers hyperspectral imaging as an efficient approach to measuring coating thicknesses.

Riana Sartori
Director of Product Management

Building Efficient and Reliable Multi-Camera Sorting Systems

Multi-camera systems often fail not because of the cameras themselves, but because of architectural choices around networking, synchronisation, and host configurations. This session provides a practical guide to optimising multi-camera systems - from small arrays to large-scale deployments - using a measurement-driven approach, covering throughput validation, CPU load, synchronisation strategies, and network design best practices. Attendees will learn how to build scalable, reliable multi camera systems that behave as a single coordinated platform.

Matthias Sonder
Technical Director & Product Manager

Teledyne’s 3D Vision System Competence - Optical Metrology with Various Technologies

Beyond the well-known classic camera portfolio, Teledyne offers a broad selection of 3D vision systems for metrology and object recognition. Laser-operated triangulation products and new systems based on depth map reconstruction deliver highly precise measurements in challenging operating conditions. The session includes integration case studies and an outlook on upcoming products.

13.00 – 16.30 Deep Dives & Demos – On-site 

The afternoon is where the programme becomes specific to your project. Demo stations and expert discussion groups are built for teams that want to move beyond slides, to compare real approaches, test assumptions and identify what to do next.

• You choose which stations to visit based on your morning track and project priorities
• Discussions are technical and focused — not product pitches
• You can compare two different technology approaches for the same inspection challenge in one afternoon
• STEMMER IMAGING application engineers are present throughout to connect technology discussion with integration and feasibility questions

High-end 1D inspection for semiconductor and high-speed web applications
Demo: HS2 scanning a wafer | Expert: Dale Deering

Line speed and sensitivity trade-offs, suitability for fine structures, UV vs. visible vs. SWIR decision criteria, acquisition chain design 

1D cameras and CIS — deployment speed and inspection flexibility
Demo: Linea Lite / Tetra on a drum, AxCIS Colour on a drum  ·  Expert: Matt Moser

When CIS simplifies deployment vs. when line scan remains preferable, lighting concepts, setup complexity, commissioning effort, colour and multi-spectral options

Linear confocal imaging for nano-scale features and surface detail
Demo: Z3  ·  Expert: Matthias Sonder

Nano-scale feature detection, depth information extraction, cycle time vs. resolution trade-offs, optical setup constraints and integration requirements

Hyperspectral imaging for material differentiation and coating tasks
Demo: Kaleido  ·  Expert: STEMMER IMAGING, Dale Deering

Coating-related evaluation concepts, material differentiation use cases, data complexity, integration requirements, proof-of-concept planning

Interfaces, acquisition and scalable system architectures
Demo: Common Vision Blox RDMA/RoCEv2  · Expert: Manny Romero, Riana Sartori, STEMMER IMAGING

GenTL and interface abstraction in practice, RoCEv2 opportunities and risks, bandwidth planning, synchronisation strategies, host architecture for multi-camera setups

3D laser triangulation for metrology and object measurement
Demo: Z-Trak2  ·  Expert: Dr. Martin Klenke, Philipp Zieboll
Measurement stability and accuracy under production conditions, integration requirements, suitable object types and surface properties, triangulation vs. structured light vs. depth-map approaches