

Events & Webinare
Versäumen Sie keine wichtigen Termine rund um die Bildverarbeitung!
Events 2026
15.-16. April 2026
STEMMER IMAGING, München, Deutschland


Interpack / Components
7.-13. Mai 2026
Düsseldorf, Deutschland


SANTExpo
19.-21. Mai 2026
Paris, Frankreich


Elmia Automation
19.-22. Mai 2026
Jönköping, Schweden


Automation Xperience (Vision, Motion, Robotics)
17.-18. Juni 2026
Brabanthallen 's-Hertogenbosch, Niederlande


Cfia
22.-24. September 2026
Toulouse, Frankreich


VISION 2026
06.-08. Oktober 2026
Stuttgart, Deutschland


Scanautomatic
08.-10. Oktober 2026
Gothenburg, Schweden


Advanced Engineering
4.-5. November 2026
Birmingham, UK


electronica
10.-13. November 2026
München, Deutschland


ZIE 2026 – Rotterdam | Niederlande
- 26. März 2026
- Van Nelle Fabriek | Stand 17
Machine Vision between innovation and industrial reality
Emerging vision technologies are powerful — their true value, however, is defined by how reliably they perform in industrial environments.
At ZIE 2026, STEMMER IMAGING positions machine vision as a structured system decision. As a manufacturer-independent value-added distributor, we combine technological diversity with application-driven integration expertise across the complete vision stack.
Key focus areas include:
- Allied Vision ALECS smart camera platform
- LMI Gocator 3D smart sensor technology
- Structured evaluation workflows with Open eVision Studio
- Manufacturer-independent value-added distribution and system expertise
By aligning technology selection, system architecture and long-term availability, STEMMER IMAGING supports scalable and industrially viable machine vision solutions.
We look forward to exchanging ideas with you at ZIE 2026.


Global Industrie 2026 – Paris | Frankreich
- 30. März - 02. April 2026
- Paris Nord Villepinte | Stand 5R79
Machine Vision als skalierbarer Systembaustein.
Industrie denkt in integrierten Lösungen – von der Robotik über 2D- und 3D-Bildverarbeitung bis hin zu Embedded-Architekturen und Software-Workflows. Genau in diesem Umfeld positioniert STEMMER IMAGING seine Expertise auf der Global Industrie 2026.
Am Messestand stehen folgende Themen im Fokus:
- Integration von 2D- und 3D-Bildverarbeitung in robotische Umgebungen
- Hochpräzise 3D-Sensorik für anspruchsvolle industrielle Anwendungen
- Leistungsfähige Code-Reading-Technologien und Linescan-Systeme
- Embedded-Vision-Architekturen in Kombination mit modularen Software-Workflows
- Strukturierte Evaluierungs- und Implementierungsansätze für Machine-Vision-Projekte
Als herstellerunabhängiger Value-Added Distributor verbindet STEMMER IMAGING technologische Vielfalt mit fundiertem Systemverständnis über den gesamten Vision-Stack hinweg.


Meet the Experts from Canada
- 15.-16. April 2026
- München/ Hybrid
- Kap West, Friedenheimer Brücke 16
From Portfolio to Proof.
This event is your unique opportunity to get direct answers to specific technical questions from the Teledyne Vision Solutions product managers and technical experts from Canada.
The STEMMER IMAGING Technology Days | Edition Teledyne Vision Solutions are two focused days designed for engineers and project teams at any stage of evaluation or implementation.
Expect a practical mix of technical sessions, hands-on workshops and live demos - on site or online.
Event at a glance
Day 1 - 15 April - Meet the Experts – On-site
10:00 – 16:30 One-to-one meetings with Teledyne Vision Solutions product managers. Limited slots, booking via registration form.
17:00 PM Round-off the day: Get-Together with Food, Drinks and informal networking.
Day 2 - 16 April - Technology Day – On-site & Online
10:00 – 12.00 Technology and product focussed Sessions - Attend Online
13:00 – 16.30 Deep-Dives and workstation time with Teledyne experts, Live Q&A: technical discussion and troubleshooting across use cases and setups
Day 1 - Meet the Experts
The Teledyne Vision Solutions team in Munich
On Day 1, book your private one-to-one meeting with the specialist whose product area most closely matches your current project or evaluation. Select your preferred expert when registering.
Dale Deering - LineScan

Dale Deering - VP Product Marketing & LineScan Product Management
Over 25 years in machine vision spanning development and business leadership. Dale oversees product and business development for machine vision cameras at Teledyne, with deep expertise in high-speed and line-scan imaging applications. He serves on the A3 Vision & Imaging Technology Strategy Board.
1D | TDI | Hyperspectral Imaging
Riana Sartori - 2D

Riana Sartori - Director of Product Management
Riana is responsible for Teledyne's full area scan camera portfolio, covering USB3, GigE, CoaXPress, Camera Link, and CameraLink HS. She is the primary contact for 2D area scan product decisions, roadmap questions, and technical positioning across interfaces.
2D | CMOS Sensors | Interfaces
Manny Romero - Frame Grabbers, Acquisition & 2D Cameras

Manny Romero - Senior Product Manager
With 28 years at Teledyne (formerly Coreco Imaging and Dalsa), Manny covers frame grabbers, acquisition drivers, and software — as well as specific 2D cameras including the Falcon4-CLHS and Genie Nano. His expertise spans GigE Vision, CLHS, CoaXPress, Camera Link, and acquisition software.
2D | Interfaces | Frame Grabbers
Matthias Sonder - Z3

Matthias Sonder - Technical Director & Product Manager
Technical Matthias leads technical strategy at Teledyne Vision Solutions and manages the Z3 product line. He is the right contact for in-depth technical architecture discussions and platform-level questions.
3D Metrology | Hyperspectral
Matt Moser - AxCIS

Matt Moser - Product Manager
Matt brings 20 years of experience in CMOS sensor and camera R&D. His primary focus is 1D sensors and cameras, and he leads product management for the AxCIS line — the right contact for contact image sensor applications and high-resolution 1D imaging discussions.
Contact image sensors | Line scan cameras
Dr. Martin Klenke - 3D Portfolio

Dr. Martin Klenke - Market Development Leader
Dr. Klenke leads market development for Teledyne's 3D vision portfolio, with a focus on application guidance across 3D sensing technologies and emerging 3D market opportunities.
3D | Integrated Vision Solutions
Day 2 – Sessions & Deep-dives
10.00 – 12.00 Presentations – Online & On-site
Semiconductor Inspection at Speed
The semiconductor market is growing fast - and so is the need for inspection. Learn about the products and technologies that have made Teledyne the global leader for these inspections, from wafer and die-stacking to packaging and populated circuits, using UV or SWIR illumination to detect the invisible, enabling the speed and efficiency required for this highly competitive market.
Becoming Interface Agnostic - Minimising Development Across Diverse MV Interfaces
Companies building next-gen machine vision solutions need to move fast and efficiently. GenTL streamlines integration across MV interfaces, cutting development effort, vendor dependency and time to market. Next-gen GigE interfaces aggregate data and enable efficient embedded solutions. This session examines Ethernet-based RDMA approaches such as RoCEv2, covering performance, hardware support, scalability, and integration risks with a clear focus on practical realities and risks of interface adoption and management.
Building Efficient and Reliable Multi-Camera Sorting Systems
Multi-camera systems often fail not because of the cameras themselves, but because of architectural choices around networking, synchronisation, and host configurations. This session provides a practical guide to optimising multi-camera systems - from small arrays to large-scale deployments - using a measurement-driven approach, covering throughput validation, CPU load, synchronisation strategies, and network design best practices. Attendees will learn how to build scalable, reliable multi camera systems that behave as a single coordinated platform.
Rapid Web Scanning & Metrology Deployment
Contact Image Sensors have made the deployment of web scanning systems significantly easier and more efficient. Learn how these all-in-one products can be rapidly deployed to reduce cost of ownership while delivering both image and accurate metrology data. Multi-source illumination, high-dynamic range imaging, and flexible lighting configurations make it possible to isolate many different defect types without complex multi-component systems.
High-Speed Microscopic Surface Inspection - Techniques for Efficient Nano-Scale Inspection
Microscopic surface inspection is particularly challenging when covering large areas with very fine details. Time-Delayed Integration and Linear Confocal Imaging address the constraints of limited illumination, nano-scale features, and rapid cycle times. The session also covers hyperspectral imaging as an efficient approach to measuring coating thicknesses.
Teledyne’s 3D Vision System Competence - Optical Metrology with Various Technologies
Beyond the well-known classic camera portfolio, Teledyne offers a broad selection of 3D vision systems for metrology and object recognition. Laser-operated triangulation products and new systems based on depth map reconstruction deliver highly precise measurements in challenging operating conditions. The session includes integration case studies and an outlook on upcoming products.
13.00 – 16.30 Deep Dives & Demos – On-site
Hands-on advanced sessions with Teledyne experts, taking the morning presentations further with demos, technical deep-dives, and discussion of your specific use cases.



