DALSA XTIUM3-CLHS PX8
SKU#:
64161
High-performance frame grabber with CLHS interface.
Hinweis: Das tatsächliche Produkt kann von der Abbildung abweichen!
Die Downloads finden Sie unter der entsprechenden Produktserie:
Teledyne DALSA - Xtium3
List Price
Your Discount
Your Price
2.711,00 €
Product not available in your country
Preis und Verfügbarkeit auf Anfrage
Kontakt aufnehmen
Preise anfragen
Errors and changes excepted. Our general terms and conditions apply. We supply exclusively to corporate customers.
Product Features
| Attributes | |
|---|---|
| Interface/Standard | CameraLink HS |
| Inputs | CLHS CX4 |
| Connectors | 2* CX4, DH60-27P |
| Number of cameras (max) | 1 |
| Onboard processing | yes |
| PC: Internal Expansion Bus | PCIe x8 (Gen4) |
| Manufacturer | Teledyne DALSA |
| Certificates | CE, FCC, RoHS, UKCA |
| Design (plug-in card/box) | Plug-in card |
| Dimensions (LxH, mm) | 130 x 100 |
| Driver support | Teledyne DALSA Sapera |
| I/Os | yes |
| Numbers of connectors (Video) | 1 |
| Onboard memory (MB) | 8192 |
| Operating system | Linux, Windows |
| Operating temperature (°C) | 10 - 50 |
- High-performance Camera Link HS frame grabber compliant with CLHS v1.1
- PCIe Gen4 x8 interface delivering up to 12.5 GB/s to host memory
- Supports up to 7 CLHS lanes with total bandwidth of 72.2 Gbps
- Compatible with monochrome area scan and line scan cameras, including Teledyne DALSA’s Linea HS2 16K
- 4 GB image buffering plus 4 GB on-board processing memory
- Real-time hardware image processing including TDI, FFC, LUT, and flip
- Integrated Trigger-to-Image Reliability (T2IR) for deterministic acquisition
- Data forwarding enables distributed processing across multiple systems
- Multi-board synchronization for simultaneous multi-camera acquisition
- Supported by Common Vision Blox and Teledyne Sapera LT SDK
STEMMER IMAGING - Mehr als nur ein Produkt!
STEMMER IMAGING bietet ein breites Spektrum an Mehrwert-Dienstleistungen, die wir auf Ihre individuellen Anforderungen abstimmen - von einfachen Aufgaben bis hin zu komplexen Hochleistungslösungen.
Mehr