TechNews #10 2026
24K telecentric optics + 1200 dpi CIS
In this month edition:
- AT IRSX-2 - Thermographic quality control with the processing built into the camera
- Mitsubishi Electric CX-2 1200 dpi and CXF-NL - 1200 dpi monochrome CIS and colour CIS with greater depth of field
- VICO DTCA - Bi-telecentric precision for 24K line scan and large-format area scan cameras
- Zivid 3 XL250 - Full-pallet 3D vision from a fixed camera position
- Advanced Engineering UK - Meet our vision specialists at booth M154, NEC Birmingham
- electronica Germany - Latest developments in industrial imaging for electronics & semiconductor applications in Munich
- i4.0 Expo Portugal - The future of computer vision awaits you at the i4.0 Expo 2026
- Robovision Experience Spain - Real-World Automation, Robotics and Machine Vision
AT IRSX-2 Camera
Measure and evaluate – directly in the camera.
Temperature deviations in production can indicate quality issues at an early stage. Reliable detection, however, requires continuous and automated monitoring directly at the machine. The IRSX-2 is the next generation of AT's smart infrared camera platform for temperature monitoring and automated thermal inspection.
- Smart Processing App on board: Evaluation runs directly on the camera, without requiring a separate PC at the machine.
- App and job concept with multiple AOIs: A single camera can monitor several parts or process steps, configured via a web interface.
- Modbus, REST API, Ethernet and GigE Vision App: Results can be transferred directly to PLCs, industrial IoT systems, customer-specific applications or third-party software.
- IP67 housing, M12 connectors and three lens options: With focal lengths of 4.9, 9.2 and 13.6 mm, the camera can be installed close to the process in harsh environments while matching the field of view to the application.
Mitsubishi Electric CX-2 1200 dpi Series and CXF/CXF2-NL Series
Finer detail in monochrome. More depth of field in colour.
Surface inspection of printed circuit boards, print and continuous webs requires fine detail across the full width, often in tight installation space. Mitsubishi Electric offers two contact image sensor (CIS) series with a CoaXPress CXP-6 interface: the CX-2 1200 dpi Series for monochrome and the CXF/CXF2-NL Series for colour inspection.
CX-2 1200 dpi Series
- 1200 dpi, up to 38,016 pixels: 1200 dpi resolution for fine structures such as narrow conductor tracks.
- 365, 621 and 804 mm scan widths: Three sensor variants covering different object widths.
- Optional integrated illumination, single 24 V supply: LED lighting and sensor share one power supply, reducing wiring effort.
CXF/CXF2-NL Series
- Tri-linear CMOS colour sensor, 600 dpi: Colour deviations and defects are captured in a single pass.
- More than 3.6× the depth of field, 27.3 mm working distance: Images stay sharp when material flutters or varies in height, with room for external lighting.
- Scan widths from 367 to 1064 mm: The new CXF2 models extend the series to narrower webs and machines.
VICO DTCA Series
High-resolution inspection, even across large fields of view.
In semiconductor wafer, through-glass via (TGV) and flat-panel display inspection, resolving fine structures while maintaining measurement accuracy is critical. VICO's DTCA series combines high-resolution bi-telecentric optics with support for large-format sensors, enabling precise dimensional measurement and fine-detail inspection even across large inspection areas.
- High-precision bi-telecentric optics: Designs achieving distortion below 0.01% and telecentricity below 0.05° minimise geometric errors and magnification changes for precise dimensional measurements.
- Large-format sensor compatibility: Supports up to 24K line-scan cameras with image circles up to 88 mm for wide-area inspection, plus options for 150 MP area-scan cameras.
- Excellent fine-detail contrast: Image-side MTF30 reaching 139 lp/mm within the series helps preserve contrast in fine structures and patterns for reliable inspection with compatible sensors.
- Large numerical aperture up to 0.21: Increased light collection enables shorter exposures and higher inspection throughput where depth-of-field requirements allow.
- Wide range of magnifications and fields of view: 0.33× to 7.5× magnification and approximately 9 to 245 mm object field of view, with adjustable iris, apochromatic designs and coaxial illumination options.
Zivid 3 XL250
Pallets and bins keep getting bigger. The camera no longer has to move.
Robotic depalletising and large-bin picking depend on 3D data the robot can rely on in every cycle. The Zivid 3 XL250 is the newest model in Zivid's 3D camera lineup for warehouse automation.
- Long working distance and optimised field of view: Full-size pallets and large bins are captured from one position, keeping cycle times short.
- Stable imaging under varying light and temperature: Point clouds stay consistent in real warehouse conditions.
- High-quality 2D and 3D data across the full working volume: Accurate object recognition and pick points on diverse objects and surfaces.
- One camera family with the Zivid 2+ R series: Depalletising, order picking and item consolidation from one vendor, with less development effort, CAPEX and spare parts inventory.
Advanced Engineering 2026 UK
Eyes for your machines. Smart vision, real impact.
Advanced Engineering UK is a meeting point for engineers and manufacturers working on automation and production. STEMMER IMAGING's machine vision specialists will be at the show to discuss specific applications.
- Time for in-depth conversations: About individual vision tasks, from the first feasibility check to implementation.
- System expertise beyond components: Cameras, optics, lighting, software and services combined into vision systems tailored to each application, from individual modules to turnkey set-ups.
- Inline quality control, traceability and packaging applications: Practical examples of robust inspection and measurement in demanding production environments.
- Embedded vision and AI tools: How embedded systems and AI-based image processing support smart production flows.
Advanced Engineering UK 2026
Booth M154, NEC Birmingham
4–5 November 2026
electronica 2026 Germany
World's leading trade fair for electronics, components & systems
Meet our team and discuss the latest developments in industrial imaging for electronics and semiconductor applications.
STEMMER IMAGING will participate in electronica 2026 in Munich, one of the leading international events for the electronics industry. The event provides an opportunity to exchange technical insights, discuss current machine-vision requirements and present selected imaging technologies for demanding inspection and automation tasks.
electronica 2026
Booth A4.553, Messe München
10–13 November 2026
i4.0 Expo Portugal
The future of computer vision awaits you at the i4.0 Expo 2026
From 11 to 13 November, discover the latest developments in machine vision, deep learning and industrial automation. STEMMER IMAGING will be there to demonstrate how machine vision can help you improve production efficiency and quality—and strengthen your competitiveness.
i4.0 Expo Portugal
Hall 1 | Stand 1A09
EXPOSALÃO – Batalha
11–13 November 2026
Robovision Experience 2026 Spain
Real-World Automation, Robotics and Machine Vision
Join Festo, KUKA and STEMMER IMAGING on 19 November at CIDAUT for a technical event featuring practical solutions, live demonstrations and expert insights into more efficient, flexible and safer industrial processes.
Robovision Experience 2026
CIDAUT – Valladolid
19 November 2026
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